Wi-Fi HaLow Modules
ready to design in
Our Wi-Fi HaLow modules are the fastest way to design Morse Micro silicon into a product: Morse Micro SoCs with the RF front end and host interface pre-configured to maximize performance. The best possible range, low power, and throughput out of our chips, without taking on the resource-intensive RF design a new radio demands.
Production ready modules
A range of Wi-Fi HaLow modules, based on our SoCs and developed in partnership with leading technology providers, offer an exceptional range, interoperability, and scalability, for real world applications.
FGH200M
FGH200M is Quectel's second-generation Wi-Fi HaLow module, pairing the Morse Micro MM8108 with an 11 x 10 mm footprint and up to 26 dBm of output power.
- ManufacturerQuectel
- ChipMM8108
- Frequency Range850–950 MHz
- CertificationCE / FCC / IC / RCM
- Form factorLGA, 38-pin
- Dimensions11.0 x 10.0 x 2.0 mm
- Max power26 dBm
FGH100M-H
FGH100M-H is Quectel's high-power variant of the FGH100M, delivering up to 27 dBm across the 902–928 MHz band for deployments that demand maximum reach.
- ManufacturerQuectel
- ChipMM6108
- Frequency Range902–928 MHz
- CertificationsFCC / RCM
- Form factorLGA, 44-pin
- Dimensions13.0 x 13.0 x 2.2 mm
- Max power27 dBm
FGH100M
FGH100M is a long-range, low-power Wi-Fi HaLow module from Quectel, built on the Morse Micro MM6108 and compliant with the IEEE 802.11ah standard.
- ManufacturerQuectel
- ChipMM6108
- Frequency Range850–950 MHz
- CertificationsCE / FCC / IC / RCM
- Form factorLGA, 44-pin
- Dimensions13.0 x 13.0 x 2.2 mm
- Max power27 dBm
Morse Micro Products
Explore our other Morse Micro Wi-Fi HaLow products.
Chips
At the core of everything we build, Morse Micro's chips are the longest reaching, fastest, smallest and lowest power Wi-Fi HaLow SoCs on the market.
Development Resources
Plug-and-play kits to test range, throughput and power in your own environment.
Design Partner Program FAQ.
